Cover plate for semiconductor devices

Details Cover plate for semiconductor devices Cover plate for semiconductor devices

1989-02-22

1992-03-17

Marcus, Stephen

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Closures

174 524, H01L 2304

Patent

active

050960814

ABSTRACT:
A metal cover plate for covering a semiconductor chip mounted on a package base plate comprises an upper central portion, a flange extending outwardly from outer edges of the central portion, and a side wall portion extending perpendicularly from the flange along all sides thereof. The central portion has at least one portion in parallel with the package base plate. The central portion is formed with reinforcing portions in the form ridges of gable roofs and valleys in cross section, formed along diagonal lines of the central portion or in the form of a ridge or rib substantially semicircular in cross section extending upwardly or downwardly along each diagonal line. Deflection of the top wall portion of the package during pressure application is thus be minimized.

REFERENCES:
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patent: 3327896 (1967-06-01), Asenbauer
patent: 4109818 (1978-08-01), Hascoe et al.
patent: 4126758 (1978-11-01), Krumme
patent: 4291815 (1981-09-01), Gordon et al.
patent: 4331253 (1982-05-01), Gordon et al.
patent: 4450959 (1984-05-01), Sommer
patent: 4604495 (1986-08-01), Watanabe et al.
patent: 4640436 (1987-02-01), Miyoshi et al.
patent: 4640438 (1987-02-01), Trevison et al.
patent: 4746583 (1988-05-01), Falange

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