Cover for semiconductor device packages

Details Cover for semiconductor device packages Cover for semiconductor device packages

1986-03-17

1987-02-03

Hall, George T.

Receptacles

Closures

Removable closure retained by adhesive or fusion means

220200, 174 52S, 174 52FF, 29588, B65D 4100

Patent

active

046404384

ABSTRACT:
Covers for semiconductor packages are made by diffusion pressure bonding a coated substrate to a preform at a temperature below the melting point of the preform alloy. An alloy preform is coated on one side with a thin layer of the preform alloy component that has a lower melting point than the preform alloy, preferably the lowest melting point. Coated substrate and coated preform are assembled and the assembly is compressed and heated below the melting point of the preform alloy but above the melting point of the preform coating to form a diffusion pressure bond between substrate and preform.

REFERENCES:
patent: 3823468 (1974-07-01), Hascoe
patent: 3874549 (1975-04-01), Hascoe
patent: 3946190 (1976-03-01), Hascoe
patent: 4331253 (1982-05-01), Gordon et al.
patent: 4331258 (1982-05-01), Geschwind
patent: 4356047 (1982-10-01), Gordon et al.
patent: 4560084 (1985-12-01), Wolfson

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