Metal fusion bonding – Process – Specific mode of heating or applying pressure
Reexamination Certificate
2008-01-22
2008-01-22
Johnson, Jonathan (Department: 1793)
Metal fusion bonding
Process
Specific mode of heating or applying pressure
C228S059000, C439S135000
Reexamination Certificate
active
11075457
ABSTRACT:
A presently-preferred embodiment of a cover for a ball-grid array connector comprises a top member and a first and a second side member adjoining opposing ends of the top member. The first and the second side members each have a mating feature formed thereon for engaging a housing of the ball-grid array connector by way of a respective complementary mating feature formed in the housing so that the cover is movable between a first and a second position in relation to the housing.
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U.S. Appl. No. 09/691,811, filed Oct. 19, 2000.
Emenheiser Matthew S.
Shue Thomas L.
Aboagye Michael
FCI Americas Technology Inc.
Johnson Jonathan
Woodcock & Washburn LLP
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