Cover for ball-grid array connector

Details Cover for ball-grid array connector Cover for ball-grid array connector

2008-01-22

2008-01-22

Johnson, Jonathan (Department: 1793)

Metal fusion bonding

Process

Specific mode of heating or applying pressure

C228S059000, C439S135000

Reexamination Certificate

active

07320426

ABSTRACT:
A presently-preferred embodiment of a cover for a ball-grid array connector comprises a top member and a first and a second side member adjoining opposing ends of the top member. The first and the second side members each have a mating feature formed thereon for engaging a housing of the ball-grid array connector by way of a respective complementary mating feature formed in the housing so that the cover is movable between a first and a second position in relation to the housing.

REFERENCES:
patent: 4217024 (1980-08-01), Aldridge et al.
patent: 4536955 (1985-08-01), Gudgeon
patent: 4767344 (1988-08-01), Noschese
patent: 4878611 (1989-11-01), LoVasco et al.
patent: 4979664 (1990-12-01), Lyons et al.
patent: 5192228 (1993-03-01), Collins et al.
patent: 5214308 (1993-05-01), Nishiguchi
patent: 5317803 (1994-06-01), Spigarelli et al.
patent: 5361492 (1994-11-01), Miyazawa
patent: 5490040 (1996-02-01), Gavdenzi et al.
patent: 5507657 (1996-04-01), Seto et al.
patent: 5637008 (1997-06-01), Kozel
patent: 5691041 (1997-11-01), Frankeny et al.
patent: 5702255 (1997-12-01), Murphy et al.
patent: 5742484 (1998-04-01), Gillette et al.
patent: 5743009 (1998-04-01), Matsui et al.
patent: 5755595 (1998-05-01), Davis et al.
patent: 5810607 (1998-09-01), Shih et al.
patent: 5874776 (1999-02-01), Kresge et al.
patent: 5876219 (1999-03-01), Taylor et al.
patent: 5883782 (1999-03-01), Thurston et al.
patent: 5888884 (1999-03-01), Wojnarowski
patent: 5919050 (1999-07-01), Kehley et al.
patent: 5955888 (1999-09-01), Frederickson et al.
patent: 5984726 (1999-11-01), Wu
patent: 6012948 (2000-01-01), Wu
patent: 6059170 (2000-05-01), Jimarez et al.
patent: 6089878 (2000-07-01), Meng
patent: 6152756 (2000-11-01), Huang et al.
patent: 6174198 (2001-01-01), Wu et al.
patent: 6179196 (2001-01-01), Heim et al.
patent: 6183301 (2001-02-01), Paagman
patent: 6193529 (2001-02-01), Kimura
patent: 6196871 (2001-03-01), Szu
patent: 6202916 (2001-03-01), Updike et al.
patent: 6210197 (2001-04-01), Yu
patent: 6215180 (2001-04-01), Chen et al.
patent: 6220884 (2001-04-01), Lin
patent: 6220895 (2001-04-01), Lin
patent: 6257478 (2001-07-01), Straub
patent: 6504095 (2003-01-01), Hoffstrom
patent: 6544046 (2003-04-01), Hahn et al.
patent: 6672907 (2004-01-01), Azuma
patent: 6743039 (2004-06-01), Shirai et al.
patent: 6780054 (2004-08-01), Yip et al.
patent: 6791189 (2004-09-01), Pearson et al.
patent: 6936793 (2005-08-01), Shiloh et al.
patent: 2003/0207622 (2003-11-01), Gutierrez et al.
patent: 0 789 422 (1997-08-01), None
patent: 0 812 5379 (1996-05-01), None
patent: WO 97/43885 (1997-11-01), None
patent: WO 97/44859 (1997-11-01), None
patent: WO 98/15989 (1998-04-01), None
U.S. Appl. No. 09/691,811, filed Oct. 19, 2000.

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