Coupling system and method for attaching thermal components...

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C361S704000, C361S710000, C361S719000, C165S080300, C165S185000, C174S016300, C257S718000, C257S719000, C257S722000

Reexamination Certificate

active

07903413

ABSTRACT:
A system and method are provided including a first thermal component adapted for thermal communication with an integrated circuit, and a second thermal component adapted for thermal communication with the first thermal component upon engagement therewith. Further provided is a coupler slidably coupled to the first thermal component and/or the second thermal component. In use, such coupler is capable of a first orientation for disengaging, the first thermal component and the second thermal component, and a second orientation for engaging the first thermal component and the second thermal component.

REFERENCES:
patent: 5304735 (1994-04-01), Earl et al.
patent: 6109340 (2000-08-01), Nakase et al.
patent: 6396693 (2002-05-01), Shih
patent: 6396695 (2002-05-01), Lee et al.
patent: 6452804 (2002-09-01), Dibene et al.
patent: 6470962 (2002-10-01), Pao
patent: 6519155 (2003-02-01), Walkup
patent: 2006/0023423 (2006-02-01), Kuo et al.
patent: 2006/0120051 (2006-06-01), Macris et al.
U.S. Appl. No. 60/869,590, filed Dec. 12, 2006.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Coupling system and method for attaching thermal components... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Coupling system and method for attaching thermal components..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Coupling system and method for attaching thermal components... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2695689

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.