Coupling structure of optical fiber and optical semiconductor el

Optical waveguides – With disengagable mechanical connector – Optical fiber to a nonfiber optical device connector

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385 83, 385 92, G02B 636

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active

057178038

ABSTRACT:
The optical fibers are arranged in a V groove formed at the surface of a silicon substrate and a cover is provided thereon. An electrode for solder bump is respectively formed at the position opposed with each other to the substrate and cover. These substrate and cover are deposited with solder in order to fix the optical fibers. The substrate or cover is previously provided, at the end point part of the optical fibers, with the mark for the positioning in the longitudinal direction of the optical fibers. The optical fibers are positioned with this mark. Here, the side surface of the optical fibers is provided with the metallized area at the position located in the predetermined distance from the end point thereof. Before fixing with the cover, the optical fibers can be deposited automatically to the predetermined position without alignment due to the self-alignment effect between the mark and metallized area. Meanwhile, the optical element can be deposited with the solder bump without adjustment to the area near the end point of the optical fiber by utilizing the self-alignment. Here, it is also possible to form the mark to the substrate for measuring the mounting position of the optical element after deposition thereof.

REFERENCES:
patent: 5412748 (1995-05-01), Furuyama et al.
patent: 5548673 (1996-08-01), Kitamura et al.
patent: 5557695 (1996-09-01), Yamane et al.

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