Coupling structure between optical semiconductor and optical wav

Optical waveguides – With disengagable mechanical connector – Optical fiber to a nonfiber optical device connector

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385 88, G02B 600, G02B 636

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active

054147875

ABSTRACT:
A structure and a method for coupling an optical semiconductor and an optical waveguide with high accuracy and productivity is disclosed. The semiconductor is mounted on a first substrate which is formed with a groove. A short optical fiber is received in the groove such that it is positioned at the same height as the light emitting portion of the semiconductor. The waveguide is formed on a second substrate while a groove is formed in the second substrate on the imaginary extension of the waveguide. The upper half of the short fiber is received in the groove of the second substrate, so that the fiber and waveguide are coupled to each other. To position the semiconductor relative to the first substrate, marks are provided on the mounting surface of the semiconductor and the surface of the first substrate and implemented by thin films which are opaque for infrared rays. The position of the semiconductor is adjusted by the steps of radiating infrared rays, calculating the areal centers of gravity of the marks, and moving the semiconductor until the areal centers of gravity align with each other.

REFERENCES:
patent: 4466696 (1984-08-01), Carney
patent: 4639074 (1987-01-01), Murphy
patent: 4788406 (1988-11-01), Holman et al.
patent: 4892374 (1990-01-01), Ackerman et al.
patent: 4904036 (1990-02-01), Blonder
patent: 4930854 (1990-06-01), Albares et al.
patent: 5277930 (1994-01-01), Uchida
patent: 5299276 (1994-03-01), Okamura et al.
Cohen, Mitchell S. et al., "Packaging of High-Density Fiber/Laser Modules Using Passive Alignment Techniques", IEEE Transactions on Components, Hybrids, and Manufacturing Technology, vol. 15, No. 6, Dec., 1992, New York, U.S., pp. 944-954.
"Optical Module with a Silica-Based Planar Lightwave Circuit for fiber-Optic Subscriber Systems" by H. Terui, et al. IEEE Photonics Technology Letters, vol. 4, No. 6, pp. 660-662, Jun. 1992.
"A compact Multichannel Transceiver Module Using Planar-Processed Optical Waveguides and Flip-Chip Optoelectronic Coponents" by K. P. Jackson et al. IEEE 0569-5503/92/0000-0093 (1992 pp. 93-114).

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