Coupling structure and method of resin moldings

Details Coupling structure and method of resin moldings Coupling structure and method of resin moldings

1991-02-08

1992-07-21

Kundrat, Andrew V.

Joints and connections

Structurally installed in diverse art device

403339, 403267, 403340, F16B 100

Patent

active

051317788

ABSTRACT:
A coupling structure and a method of coupling resin structures wherein a first member is coupled with a thermoplastic second member through a coupling force produced by constricting the volume of the resin during molding and/or the generation of an undercut structure. The undercut structure results from the deformation of a projection member caused by the flow pressure and temperature of the resin. A recess is provided in one of the members. The recess is indented in the laying direction. On the other member, a projection is provided which enters the recess. The coupling of the two members is therefore simple and does not require the use of a subsidiary material. Additionally, when an undercut structure is formed, extremely strong coupling is obtained. Since the undercut is formed by deformation of the projection, no undercut structure is required to be formed on the die, so that no extra cost or burden has to be forced on the die.

REFERENCES:
patent: 4155478 (1979-05-01), Ogi
patent: 4201209 (1980-05-01), LeVeen et al.
patent: 4318604 (1982-03-01), Kobori
patent: 4417796 (1983-11-01), Sugiura et al.
patent: 4584155 (1986-04-01), Zanella

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