Coupling device using buried capacitors in multilayered...

Details Coupling device using buried capacitors in multilayered... Coupling device using buried capacitors in multilayered...

2006-04-25

2006-04-25

Takaoka, Dean (Department: 2817)

Wave transmission lines and networks

Plural channel systems

Having branched circuits

C333S112000

Reexamination Certificate

active

07034633

ABSTRACT:
The present invention proposes a coupling device, comprising a substrate (1), a conductive layer (2) covering a first surface of said substrate (1), at least two electromagnetically coupled lines (3a,3b) being provided opposite to said first surface and at least one thereof being covered by at least one cover layer (4, 5) wherein at least one capacitor (C1,C2,C3,C4) is connected between a first end of at least one of said at least two lines (3a,3b) and said conductive layer (2). The at least one capacitor is a buried capacitor grounded in order to equalize unequal phase velocities otherwise degrading the performance of e.g. broadside coupled structures in an inhomogeneous substrate structure such as for example microstrips in a multilayer LTCC. Therefore the present invention enables coupling devices having a high performance and offering in that way the best of all possible design scenarios in terms of wideband performance, size and cost.

REFERENCES:
patent: 3593208 (1971-07-01), Smith
patent: 5281929 (1994-01-01), Willems
patent: 5382925 (1995-01-01), Hayashi et al.
patent: 5745017 (1998-04-01), Ralph
patent: 6819200 (2004-11-01), Zhao et al.
patent: 1 003 216 (2000-05-01), None
Wadell, Brian C., “Transmission Line Design Handbook”, Artech House Publishers, 1991.

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