Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Patent
1997-02-07
1998-09-29
Sparks, Donald
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
174255, 3613062, 361765, 361794, H05K 103, H05K 111, H05K 114, H05K 116
Patent
active
058153730
DESCRIPTION:
BRIEF SUMMARY
TECHNICAL FIELD
The present invention relates to a capacitance values presenting and/or dominating coupling device where said coupling device is integrated in or belongs to a board with a printed circuit.
Such printed circuit boards, where the present invention is intended to be used, consists of several electrically conducting layers, with electrically isolating layers in between.
It is in principle possible, within practical limits, to select any number of electrically conductive layers and any number of isolating layers within a printed circuit board but the number of layers is normally limited by a required predetermined thickness of the printed circuit board.
A necessary condition for the present invention is further that at least one of said electrically conducting layers is related to a reference potential, such as ground potential, while an adjacent electrically conducting layer is related to a supply voltage.
DESCRIPTION OF THE BACKGROUND ART
Printed circuit boards of the above described manner are previously known through a number of various embodiments.
One or several discrete circuits are applied to one or both sides of printed circuit boards of this kind. These circuits can be IC-circuits, ASIC-circuits and the like, and/or components such as resistances, capacitances and the like and usually are the most of these circuits or components supplied with a voltage through connecting conductors, connected to said reference potential related layer and said supply voltage related layer, either directly through the top surface of the printed circuit board or via board related conductors, usually extended across the top surface of the printed circuit board as bare conductors.
Circuits and/or components, such as integrated circuits, are previously known in a number of various embodiments but, even though the presence of such components is a necessity for the present invention, they will not be further described here, since the specific construction of each component is not a part of the present invention.
It can nevertheless be mentioned that integrated circuits can be equipped with edge related connecting pads, to which required connecting conductors are soldered, or they can be equipped with underlying connecting pins, a so called Pin Grid Array-connection (PGA).
It can further be mentioned that printed circuit boards of this kind can be made out of a number of sheets, each sheet consisting of two thin metal-foils applied to a relatively thick interjacent electrically isolating layer with a thickness of respective isolating layer usually selected to 0.2 to 0.3 mm.
Taking the significant characteristics of the present invention under consideration it can be mentioned that it is previously known to use capacitances with a large capacitance value, so called smoothing condensers, in order to thereby be able to smooth any voltage variations originating from a rectifying bridge to thereby form a smooth and more constant direct voltage.
It can further be mentioned, taking the present invention under consideration, that it is previously known to use a so called DC/DC-converter in order to form a precisely related voltage level, essentially regardless of the current which is required.
As an example of a DC/DC-converter of this kind references are made to the patent publication U.S. Pat. No. 5,198,969.
It is also previously known that, with an application on a printed circuit board, circuits and components are in the use of further capacitive means close to respective circuit, a so called "voltage spike smoothing condenser", which in the following will be referred to as a "spike condenser".
Such spike condensers are normally discrete components which are positioned close to the circuit in question.
The connecting conductors of these are normally relatively long and thereto often bare conductors on the surface of the printed circuit board.
Every such discrete capacitive component presents, in relation to the circuit, besides a capacitive value, an inner inductive value together with inductive values originat
REFERENCES:
patent: 4441070 (1984-04-01), Davies et al.
patent: 4779185 (1988-10-01), Musil
patent: 5010641 (1991-04-01), Sisler
patent: 5065284 (1991-11-01), Hernandez
patent: 5079069 (1992-01-01), Howard et al.
patent: 5161086 (1992-11-01), Howard et al.
patent: 5162977 (1992-11-01), Paurus et al.
patent: 5198969 (1993-03-01), Redl
patent: 5365407 (1994-11-01), Nakabayashi et al.
Johnsen Helge Bodahl
Timgren Mats Olav
Sparks Donald
Telefonaktiebolaget LM Ericsson
LandOfFree
Coupling device presenting and/or dominating a capacitance belon does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Coupling device presenting and/or dominating a capacitance belon, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Coupling device presenting and/or dominating a capacitance belon will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-691990