Patent
1990-05-18
1991-01-15
Sikes, William L.
350 9617, G02B 636, G02B 726
Patent
active
049848666
ABSTRACT:
The chip of semiconductor material (48) of an opto-electronic component is optically coupled inside a housing (40) to a length of optical fiber (43). This length of optical fiber (43) is fixed to the housing (40) at three points: a rear holding point (50) in the vicinity of the end of the optical fiber (43) in order to hold said end in its coupling position; a front holding point placed on the length of optical fiber (43) where it passes through the housing (tube 42) in order to withstand forces exerted on the length of optical fiber (43) from outside the housing; and an intermediate holding point (51) placed on the optical fiber between the front and rear holding points in order to attenuate the transmission to the rear holding point (50) of forces exerted on the length of optical fiber (43) at the front holding point by virtue of the housing (40) deforming.
REFERENCES:
patent: 4186994 (1980-02-01), Denkin et al.
patent: 4479698 (1984-10-01), Landis et al.
Boisgontier Jean Marc
Caville Christian
Sikes William L.
Societe Anonyme dite: Alcatel Cit
Wise Robert E.
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