Coupling device

Details Coupling device Coupling device

2006-08-01

2006-08-01

Takaoka, Dean (Department: 2817)

Wave transmission lines and networks

Coupling networks

Nonreciprocal gyromagnetic type

C333S033000

Reexamination Certificate

active

07084715

ABSTRACT:
Conventional stripline implementations of couplers in Multilayer Ceramic Integrated Circuit (MCIC) technology incur a cost disadvantage when compared to an equivalent microstrip implementation. This is primarily due to the increased substrate thickness needed to achieve the required performance. Conventional stripline couplers significantly limit our ability to optimise for smaller substrate thickness and therefore overall cost. However, stripline couplers are needed for stacked integration scenarios and as building blocks for complex active and passive RF circuits in MCICs. A method of implementation that overcomes this practical disadvantages is therefore highly desirable. To this end, the present invention presents a novel coupling device structure that enable RF designers to use the stripline coupler configuration, by achieving required levels of performance with much reduced substrate thickness. The invention outlines a structured design procedure and presents simulation results confirming the validity of the technique. In particular, to achieve this, the present invention proposes a coupling device, comprising a substrate1, a first conductive layer2covering a first surface of said substrate1, at least two electromagnetically coupled lines3a, 3bbeing provided opposite to said first surface and being covered by at least one cover layer4, 5, wherein at least one short-circuit stub Stub A, Stub B is connected between at least one of said electromagnetically coupled lines and said first conductive layer.

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Ou, W.P.; “Design Equations for an Interdigitated Directional Coupler”; IEEE Transactions on Microwave Theory and Techniques; vol. 23; Feb. 1975; pp. 253-255.
Al-Taei, S. et al.; “Design of High Directivity Directional Couplers in Multilayer Ceramic Technologies”, Microwave Symposium Digest; 2001 IEEE MTT-S International; vol. 1, 2001; pp. 51-54.

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