Electricity: conductors and insulators – Conduits – cables or conductors – Single duct conduits
Reexamination Certificate
2000-02-18
2002-02-12
Reichard, Dean A. (Department: 2831)
Electricity: conductors and insulators
Conduits, cables or conductors
Single duct conduits
C174S135000, C016S002100, C248S050000
Reexamination Certificate
active
06346675
ABSTRACT:
BACKGROUND OF THE INVENTION
The invention relates to a micro-mechanical coupling having a coupling receiver and a coupling counterpart, which is held in a receiving depression of the coupling receiver. The invention moreover relates to a process for manufacturing such a coupling.
From “Plug-in Connectors for SMT,”
SMT International Conference
(Products-Manufacture-Processing), page 222, Hubert A. Holzmann (1987), a micro-mechanical coupling of the type mentioned at the outset is already known where, as coupling receiver, a printed circuit is provided which is penetrated transversely to its plate level by a receiver depression, into which a pointed press-in pin is inserted. The coupling counterpart forms, together with the receiver depression, a press fit which fixes the coupling counterpart in the coupling receiver in a friction-locking manner. This previously known coupling has the disadvantage that the press fit brings about tensile stress in the coupling receiver which diminishes the mechanical strength of the coupling receiver. The formation of cracks can even occur in the area of the press fit in the coupling receiver.
From the book
Micromechanics
by Anton Heuberger, page 456, Springer-Verlag (1989), a coupling of the type mentioned at the outset is already known, where the coupling receiver is a semiconductor chip having a large number of V-shaped receiver depressions on one of its surfaces, which run respectively along a straight line on the surface of the semiconductor chip. Into the-respective V-shaped receiver depressions, in the direction of travel of the receiver depression, an end region of a fiber-like optical conductor is installed. The coupling is constructed as a transceiver array, and has on the one hand receiver conductors, the ends of which are arranged adjacent to the optical receiving elements situated on the semiconductor chip, and on the other hand has coupling transmitter conductors, the ends of which are arranged adjacent to optical transmitting elements situated on the semiconductor chips, which are connected with the receiving elements through an amplifier and drive unit.
This previously known coupling has the disadvantage that the V-shaped receiver depressions occupy a not inconsiderable portion of the chip surface of the semiconductor, which can be used for the optical and electronic components located on the semiconductor chip, such as the amplifier and drive unit as well as the optical transmitting and receiving elements. This previously known coupling therefore has, on the one hand, comparatively large dimensions and, on the other hand, the manufacturing costs for the coupling are correspondingly high, as these rise out of proportion with increasing chip surface. Moreover, it is not beneficial that the V-shaped receiver depressions cannot be integrated into a wafer at all or can be only poorly integrated with standard processes usual in chip manufacture. A further disadvantage of the coupling is that the optical conductors are clamped in between the walls of the V-shaped receiver depressions in order to fix the conductors axially in the receiver depression. Through the clamping force exerted here on the conductor, mechanical tensions can arise in the optical conductor, which can alter the optical properties of the conductor.
SUMMARY OF THE INVENTION
There thus exists an object of creating a coupling of the type mentioned at the outset, which has a compact construction as well as a mechanically stable connection between the coupling receiver and the coupling counterpart. Furthermore, there exists an object of providing a process, which allows a simple and economical manufacture of such a coupling.
This object is achieved, in relation to the coupling, by the coupling receiver having a stack of layers with at least two layers, by the receiver depression being arranged in the layer stack and extending transversely in relation to its layer planes over more than one layer, by the lateral boundary wall of the receiver depression, proceeding from the surface of the layer stack bordering on the receiver depression toward the interior of the receiver depression, having at least one cutback which is formed by a layer cutback in relation to an adjacent layer or a cutback layer region, and by the coupling counterpart having laterally at least one guide projection and/or locking projection (hereinafter simply “locking projection”) which, in the coupling position, engages into the cutback of the micro-mechanical component.
The coupling counterpart is thus fixed form-locking in the receiver depression, avoiding clamping forces, whereby mechanical strains in the coupling receiver are avoided as far as possible. The coupling thereby permits a stable connection of its coupling elements. Since the receiver depression extends transverse to the layer planes of the layer stack, the receiver depression occupies only a comparatively small area of the surface of the coupling receiver, which makes possible correspondingly compact dimensions of the coupling. With a coupling receiver constructed as a semiconductor chip, chip surface can consequently be saved, which allows a correspondingly economical manufacture of the semiconductor chip. Moreover, in connection with the manufacture of the coupling, the receiver depression arranged in the layer stack enables a simple, layer by layer application of the cutback or cutbacks into the boundary wall of the receiver depression, whereby customary standard processes can be used in the micro-mechanics and/or semiconductor manufacture.
In one advantageous embodiment of the invention, it is provided that at least one cutback of the boundary wall is arranged between two layers and/or between two layer areas (hereinafter simply designated as “layers”) of the layer stack, offset in relation to each other transverse to the layer planes, and that at least one locking projection of the coupling counterpart, in the locking position, engages into the intermediate space formed between these layers. The coupling counterpart is then fixed in both its axial directions, namely in plug-in and extraction directions, by means of the locking projection, projecting in relation to the cutback, between the layers of the boundary wall arranged transverse to the layer planes of the layer stack on both sides of the cutback.
A bilateral axial fixation of the conductor on the boundary wall of the receiver can also be assured in that at least one layer arranged between two cutbacks forms a projection on the boundary wall, and in that, in the locking position of the coupling, transverse to the layering plane of this layer, respectively at least one locking projection of the coupling counterpart is arranged. With this embodiment of the invention, a projection of the boundary wall thus engages in a receiver of the coupling counterpart transverse to the layer planes of the layer stack restricted on both sides by locking projections.
In one embodiment of the invention, it is provided that the boundary wall of the receiver depression forms a laterally open sliding guide for the coupling counterpart, and that the coupling counterpart is moveable out of a pre-assembly position, in which the locking projection is out of engagement with the cutback of the micro-mechanical component, parallel to the layer planes of the layer stack, engaging with the locking projection into the cutback of the boundary wall. The coupling counterpart is then separably connectable with the micro-mechanical component by plugging in and retracting of the sliding guide.
In an especially advantageous embodiment of the invention, the coupling counterpart has on its exterior at least one resilient element which carries at least one stop projection on its exterior which, in operating position, engages into the cutback of the coupling receiver, whereby the stop projection in the coupling position of the coupling is directable against the restoring force of the resilient element from a locking position into an unlocking position. In this way, there results a plug-in coupling constructed as a sto
Gahle Hans-Jürgen
Igel Günter
Lehmann Mirko
Akin Gump Strauss Hauer & Feld L.L.P.
Micronas GmbH
Patel Dhiru R
Reichard Dean A.
LandOfFree
Coupling and method for its manufacture does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Coupling and method for its manufacture, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Coupling and method for its manufacture will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2985114