Cost-reducing and process-simplifying wiring board and...

Details Cost-reducing and process-simplifying wiring board and... Cost-reducing and process-simplifying wiring board and...

2006-02-14

2006-02-14

Vu, David (Department: 2818)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

C257S692000

Reexamination Certificate

active

06998291

ABSTRACT:
A wiring board is disclosed that includes a first insulating layer, a conductor which is formed on a surface of the first insulating layer, and a second insulating layer which is formed on surfaces of the first insulating layer and of the conductor. The wiring board is provided with a semispherical-shaped or conical-shaped hole-forming portion which penetrates through the second insulating layer into the conductor.

REFERENCES:
patent: 6054761 (2000-04-01), McCormack et al.
patent: 2002/0066672 (2002-06-01), Iijima et al.
patent: 2002-171048 (2002-06-01), None

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