Corrosion resistant lid for semiconductor package

Details Corrosion resistant lid for semiconductor package Corrosion resistant lid for semiconductor package

1985-04-22

1986-11-04

Smith, John D.

Metal fusion bonding

Process

With pretreating other than heating or cooling of work part...

29588, 204 23, 204 40, 427125, H01L 2306

Patent

active

046206612

ABSTRACT:
A lid for closing an electronic package that exhibits high resistance to corrosion. The lid includes a metal substrate and a multi-layered protective coating which has low porosity when compared to a single layer coating of the same thickness yet has good soldering properties that enables the lid to be hermetically sealed to the package container. The multi-layer coating includes an initial electroplated layer of nickel followed by a thin interlayer of a noble metal and a second layer of nickel electroplated over noble metal. A top layer of gold is then electroplated over the nickel-noble metal-nickel sandwich to complete the lid structure.

REFERENCES:
patent: 3362851 (1968-01-01), Dunster
patent: 4331258 (1982-05-01), Geschwind
patent: 4356047 (1982-10-01), Gordon

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