Metal treatment – Stock – Copper base
Patent
1998-04-03
2000-08-15
Ip, Sikyin
Metal treatment
Stock
Copper base
148279, 148282, 148687, 148433, 148434, 148435, 428547, 428674, 4272551, 427399, C22C 900
Patent
active
061030260
ABSTRACT:
A corrosion-resistant copper material has a surface layer of a copper alloy containing 10-50 at % (i.e. % by atom) of silicon and of 10-1,000 .ANG. thick. It is produced simply by annealing a copper material containing 0.01-5 at % of silicon at 100-600.degree. C. in a hydrogen-containing gas. Because of its excellent resistance to surface corrosion due to heat and aging, the resulting copper material lends itself well to automotive and electrical applications requiring heat resistance, and is also suitable for use in electrical wire and in leadframes for semiconductor devices.
REFERENCES:
patent: 4822642 (1989-04-01), Cabrera et al.
Li, Jian et al, J. Appl. Phys., 70(5), pp. 2820-2827 (1991), Oxidation and Protection in Copper and Copper Alloy Thin Films.
C. Lee et al., 1.sup.st Electronic Packaging Technology Conference, pp. 201-207, 1997, The Role of Surface Morphology on Interfacial Adhesion in IC Packaging.
T. Sato et al., Japan Electric Material Association, 34.sup.th Lecture in Autumn, (1997) (partial translation).
Noguchi Naoya
Shiobara Toshio
Yoshino Masachika
Ip Sikyin
Shin-Etsu Chemical Co. , Ltd.
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