Corrosion inhibitor additives to prevent semiconductor...

Details Corrosion inhibitor additives to prevent semiconductor... Corrosion inhibitor additives to prevent semiconductor...

2003-04-21

2010-12-21

Ghyka, Alexander G (Department: 2812)

Semiconductor device manufacturing: process

Semiconductor substrate dicing

C438S113000, C257SE21599

Reexamination Certificate

active

07855130

ABSTRACT:
An improved method of dicing a semiconductor wafer which substantially reduces or eliminates corrosion of copper-containing, aluminum bonding pads. The method involves continuously contacting the bonding pads with deionized water and an effective amount of a copper corrosion inhibiting agent, most preferably benzotriazole. Also disclosed, is an improved apparatus for dicing a wafer, in which a copper corrosion inhibiting agent is included in the cooling system for cooling the dicing blade.

REFERENCES:
patent: 5156769 (1992-10-01), Cha et al.
patent: 5461008 (1995-10-01), Sutherland et al.
patent: 6447563 (2002-09-01), Mahulikar
patent: 2002/0081776 (2002-06-01), Tellkamp

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