Core substrate and method of producing the same

Details Core substrate and method of producing the same Core substrate and method of producing the same

2008-07-10

2011-10-11

Chervinsky, Boris (Department: 2835)

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

C174S250000, C174S251000, C174S262000, C428S901000

Reexamination Certificate

active

08035037

ABSTRACT:
The core substrate is capable of securely preventing short circuit between an electrically conductive core section and a plated through-hole section. The core substrate comprises: an electrically conductive core section having a pilot hole, through which a plated through-hole section is formed; electrically conductive layers coating the inner face of the pilot hole and a surface of the core section; a gas purging hole being formed in the conductive layer coating the surface of the core section; an insulating material filling a space between the inner face of the pilot hole and an outer circumferential face of the plated through-hole section; and cable layers being laminated on both side faces of the core section.

REFERENCES:
patent: 3610811 (1971-10-01), O'Keefe
patent: 5835355 (1998-11-01), Dordi
patent: 6420017 (2002-07-01), Matsuda et al.
patent: 6599562 (2003-07-01), Matsuda et al.
patent: 6707683 (2004-03-01), Bravek et al.
patent: 6954987 (2005-10-01), Wong et al.
patent: 7304389 (2007-12-01), Yoshimura
patent: 7378326 (2008-05-01), Ahn et al.
patent: 2004-87989 (2004-03-01), None
patent: 2005-136347 (2005-05-01), None
patent: 2006-222216 (2006-08-01), None
patent: 2004/064467 (2004-07-01), None

Affiliated with

Also associated with

Rating

Core substrate and method of producing the same does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Core substrate and method of producing the same, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Core substrate and method of producing the same will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4257810