Core-shell structure metal nanoparticles and its...

Details Core-shell structure metal nanoparticles and its... Core-shell structure metal nanoparticles and its...

2007-02-22

2009-11-03

Kopec, Mark (Department: 1796)

Compositions

Electrically conductive or emissive compositions

C252S512000, C252S514000, C427S213300

Reexamination Certificate

active

07611644

ABSTRACT:
The present invention provides metal nanoparticles, containing copper core and thin layer of precious metals enclosing the core to prevent oxidization of copper, in which manufacturing the metal nanoparticles is economical efficiency because of increased copper content and since such metal nanoparticles contain a metal having high electrical conductivity such as silver for a thin layer, they can form a wiring having better conductivity than copper and there is little concern that silver migration may occur.

REFERENCES:
patent: 1049675 (1991-03-01), None
patent: 1129339 (1996-08-01), None
patent: 2003-0015593 (2003-02-01), None
patent: 1020030015593 (2003-02-01), None
Notice of Preliminary Rejection, dated Jan. 25, 2007, of the Korean Intellectual Property Office (KIPO).
Liu Zhijie et al., “Preparation of Ultrafine Core-Shell Cu0Ag Bimetallic Powers”, Journal of Norganic Chemistry, 12, 30-34, Mar. 1993.
Chinese Office Action issued on May 22, 2009 in corresponding Korean Patent Application No. 200710079515.

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