Core for electrical connecting substrates and electrical connect

Details Core for electrical connecting substrates and electrical connect Core for electrical connecting substrates and electrical connect

1994-03-23

1995-08-15

Picard, Leo P.

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

174257, 174258, 174264, 174266, 361785, 361790, H05K 100

Patent

active

054421438

ABSTRACT:
The inventive core for electrical connecting substrates, particularly for printed circuit boards and foil circuit boards, has an inner layer (I) with a columnar structure and on either side, metallic cover layers (A,A'), the columnar structure of the inner layer (I) comprising columns (9.1,9.2), which are regularly arranged, spaced from one another and from the cover layers (A,A'), being directed transversely to the service extension of the core and made from an electrically conductive material in a matrix (6) of an electrically insulating material. The cover layers (A,A') e.g. have electrical terminals (16,16', 17,17') in the form of through-plated blind holes (13,14) on selected columns (9) of the inner layer (I) and are structured in such a way that they have a regular pattern of terminals (16,16') on the facing cover layer and terminals (17,17') on the through-connections insulated from the cover layers, this grid pattern can have a size of approximately 0.5 mm.

REFERENCES:
patent: 4511757 (1985-04-01), Ors et al.
patent: 5286926 (1994-02-01), Kimura et al.
patent: 5306872 (1994-04-01), Kordus et al.
patent: 5311059 (1994-05-01), Banerji et al.
patent: 5383363 (1983-05-01), Hayakawa et al.

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