Compositions: ceramic – Ceramic compositions – Refractory
Patent
1987-03-05
1989-07-25
Dixon, Jr., William R.
Compositions: ceramic
Ceramic compositions
Refractory
2502521, 436182, 264 66, 356 30, C04B 3502
Patent
active
048513768
ABSTRACT:
A process for producing a cordierite ceramic body by using a reclaimed cordierite composition for a cordierite ceramic article which has a composition similar to that of the cordierite ceramic body. The process includes the steps of: forming a desired formed body under a pressure by using a starting material which includes the recovered reclaimed cordierite composition, or a mixture of the reclaimed cordierite composition and a fresh cordierite composition; firing the formed body at a temperature between 1280.degree.-1330.degree. C. into a sample of the cordierite ceramic body; measuring a reaction ratio (R) between the amount of protoenstatite and cordierite crystals present in the sample; and formulating the starting material so that the reaction ratio (R) is 0.3 or less.
REFERENCES:
patent: 3885977 (1975-05-01), Lachman et al.
patent: 4259011 (1981-03-01), Crumm et al.
patent: 4280845 (1981-07-01), Matsuhisa et al.
patent: 4316965 (1982-02-01), Oda et al.
patent: 4434117 (1984-02-01), Inoguchi et al.
patent: 4476236 (1984-10-01), Inoguchi et al.
patent: 4495300 (1985-01-01), Sano
patent: 4687752 (1987-08-01), Peters
patent: 4698317 (1987-10-01), Inoue et al.
Chemical Abstracts, vol. 92, No. 6, Feb. 1980, p. 267, 46224d.
Asami Seiichi
Hamanaka Toshiyuki
Dixon Jr. William R.
Griffis A.
NGK Insulators Ltd.
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