Copper vapor laser modular packaging assembly

Optical: systems and elements – Optical amplifier

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372109, H01S 300

Patent

active

051683938

ABSTRACT:
A modularized packaging arrangement for one or more copper vapor lasers and associated equipment is disclosed herein. This arrangement includes a single housing which contains the laser or lasers and all their associated equipment except power, water and neon, and means for bringing power, water, and neon which are necessary to the operation of the lasers into the container for use by the laser or lasers and their associated equipment.

REFERENCES:
patent: 3771067 (1973-11-01), Kohl et al.
patent: 3906398 (1975-09-01), Low et al.
patent: 4027273 (1977-05-01), Yang
patent: 4313093 (1982-01-01), Suenaga et al.
patent: 4357649 (1982-11-01), LaCroix
patent: 4357705 (1982-11-01), Hodson
patent: 4379203 (1983-04-01), Koszytorz
patent: 4457001 (1984-06-01), Sepp et al.
patent: 4612648 (1986-09-01), Peterson et al.
patent: 4646336 (1987-02-01), Koseki
patent: 4660209 (1987-04-01), Osada et al.

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