Copper termination inks containing lead free and cadmium...

Electricity: electrical systems and devices – Electrostatic capacitors – Fixed capacitor

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C361S321500, C361S311000, C361S313000, C361S306100, C501S138000, C501S139000

Reexamination Certificate

active

06982864

ABSTRACT:
Lead-free and cadmium-free glass composition that is particularly suitable for use in conductive ink applications. The invention includes a capacitor comprising a copper termination, the copper termination is made by firing an ink including a glass component, the glass component may comprise up to about 65 mole % ZnO, up to about 51 mole % SrO, about 0.1 to about 61 mole % B2O3, up to about 17 mole % Al2O3, about 0.1 to about 63 mole % Sio2, up to about 40 mole % BaO+CaO, and up to about 20 mole % MgO.

REFERENCES:
patent: 3615772 (1971-10-01), Kohut
patent: 4152282 (1979-05-01), Baudry et al.
patent: 4220547 (1980-09-01), Abe et al.
patent: 4323652 (1982-04-01), Baudry et al.
patent: 4379319 (1983-04-01), Wilson
patent: 4517155 (1985-05-01), Prakash et al.
patent: 4880567 (1989-11-01), Prabhu et al.
patent: 4906406 (1990-03-01), Hormadaly
patent: 5051381 (1991-09-01), Ohji et al.
patent: 5165986 (1992-11-01), Gardner et al.
patent: 5296426 (1994-03-01), Burn
patent: 5439852 (1995-08-01), Hormadaly
patent: 5468695 (1995-11-01), Carroll et al.
patent: 5491118 (1996-02-01), Hormadaly
patent: 5753571 (1998-02-01), Donohue
patent: 5805409 (1998-09-01), Takahara et al.
patent: 5948536 (1999-09-01), Suzuki et al.
patent: 6105394 (2000-08-01), Sridharan et al.
patent: 6124224 (2000-09-01), Sridharan et al.
patent: 6171987 (2001-01-01), Hormadaly
patent: 6185087 (2001-02-01), Park et al.
patent: 6556422 (2003-04-01), Kim et al.
patent: 6572793 (2003-06-01), Fukui et al.
patent: 6649554 (2003-11-01), Chang et al.
patent: 6673274 (2004-01-01), Venigalla et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Copper termination inks containing lead free and cadmium... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Copper termination inks containing lead free and cadmium..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Copper termination inks containing lead free and cadmium... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3546883

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.