Copper surface treatment for epoxy bonding

Details Copper surface treatment for epoxy bonding Copper surface treatment for epoxy bonding

1974-09-25

1976-05-25

McCamish, Marion E.

Metal working

Means to assemble or disassemble

Puller or pusher means, contained force multiplying operator

204 41, 204 38E, 428336, 428344, 428349, 428354, 428416, 428418, 428474, 428458, 428209, 428210, 428901, B23P 320, B32B 314, B32B 1508

Patent

active

039583171

ABSTRACT:
A treated copper surface for bonding, using adhesive such as epoxy glass, in applications such as multilayer circuit boards. The copper surface is covered with a thin layer of chromium having a roughened (etched) outer surface. The chromium layer precludes chemical reactions which destroy the polar groups of epoxy molecules and which thereby cause delamination of copper-epoxy bonds. The etched surface greatly enhances the bond strength by providing a roughened cracked surface which provides a strong mechanical bond. Copper surfaces treated in this manner form epoxy glass bonds having tensile strengths of about 2750 psi.

REFERENCES:
patent: 3230163 (1966-01-01), Dreyfus
patent: 3244581 (1966-04-01), Miller
patent: 3536546 (1970-10-01), Nielsen
patent: 3681209 (1972-08-01), Campbell
patent: 3761303 (1973-09-01), Cox
patent: 3770571 (1973-11-01), Alsberg
patent: 3771977 (1973-11-01), Liu
patent: 3790355 (1974-02-01), Palisin
patent: 3857683 (1974-12-01), Castonguay

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