Copper surface pickling system

Cleaning and liquid contact with solids – Processes – For metallic – siliceous – or calcareous basework – including...

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134 2, 134 41, 134 42, C23G5/04

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059041579

ABSTRACT:
A copper surface pickling process is improved by providing most of the oxidizing agent (such as hydrogen peroxide) used in the process in a separate bath following a primarily acid bath. The temperature of the separate hydrogen peroxide bath can be kept lower, which reduces hydrogen peroxide loss and therefore consumption. After the hydrogen peroxide bath, the copper surface is subjected to high pressure rinsing, including a final stage in which purified (e.g., distilled) water is used.

REFERENCES:
patent: 2856275 (1958-10-01), Otto
patent: 4754803 (1988-07-01), Escobar, Jr. et al.

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