Copper/steel laminated sheet for use in manufacturing printed ci

Stock material or miscellaneous articles – All metal or with adjacent metals – Composite; i.e. – plural – adjacent – spatially distinct metal...

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

29830, 156233, 156288, 174255, 174256, 428594, 428606, 428607, 428612, 428626, B32B 1520

Patent

active

061270512

ABSTRACT:
A sheet laminate for use in a press lay-up between printed circuit board panels having a metal substrate layer and a copper foil layer disposed on at least one surface of the substrate layer. The foil layer is attached onto the surface of the substrate layer by a plurality of metal-to-metal bonds disposed along the boundary of the foil layer such that gaps are defined between the bonds.

REFERENCES:
patent: Re29820 (1978-10-01), Konicek
patent: 2688348 (1954-09-01), Sullivan
patent: 2706165 (1955-04-01), Korsgaard
patent: 3589975 (1971-06-01), Andrews et al.
patent: 3592722 (1971-07-01), Morgan
patent: 3647592 (1972-03-01), Woodberry
patent: 3730825 (1973-05-01), Nakane
patent: 3808088 (1974-04-01), Knechtges et al.
patent: 3932250 (1976-01-01), Sato et al.
patent: 3936548 (1976-02-01), Konicek
patent: 3948701 (1976-04-01), Fasbender et al.
patent: 3984598 (1976-10-01), Sarazin et al.
patent: 3990926 (1976-11-01), Konicek
patent: 4022648 (1977-05-01), Woodberry et al.
patent: 4023998 (1977-05-01), Cederberg et al.
patent: 4092925 (1978-06-01), Fromson
patent: 4113576 (1978-09-01), Hutkin
patent: 4179324 (1979-12-01), Kirkpatrick
patent: 4180608 (1979-12-01), Del
patent: 4351873 (1982-09-01), Davis
patent: 4357395 (1982-11-01), Lifshin et al.
patent: 4381327 (1983-04-01), Briere
patent: 4383003 (1983-05-01), Lifshin et al.
patent: 4394419 (1983-07-01), Konicek
patent: 4446188 (1984-05-01), Patel et al.
patent: 4455181 (1984-06-01), Lifshin et al.
patent: 4568413 (1986-02-01), Toth et al.
patent: 4587152 (1986-05-01), Gleichenhagen et al.
patent: 4715116 (1987-12-01), Thorpe et al.
patent: 4722765 (1988-02-01), Ambros et al.
patent: 4775599 (1988-10-01), Matsuoka et al.
patent: 4781969 (1988-11-01), Kobayashi et al.
patent: 4788102 (1988-11-01), Koning et al.
patent: 4847146 (1989-07-01), Yeh et al.
patent: 4872934 (1989-10-01), Kameda
patent: 4875283 (1989-10-01), Johnston
patent: 4961806 (1990-10-01), Gerrie et al.
patent: 5030302 (1991-07-01), Jud et al.
patent: 5057372 (1991-10-01), Imfeld et al.
patent: 5096522 (1992-03-01), Kawachi et al.
patent: 5120590 (1992-06-01), Savage et al.
patent: 5153050 (1992-10-01), Johnston
patent: 5350621 (1994-09-01), Yuhas et al.
patent: 5407744 (1995-04-01), Mallen Herrero et al.
patent: 5512381 (1996-04-01), Konicek et al.
patent: 5674596 (1997-10-01), Johnston
patent: 5716168 (1998-02-01), Janoff
patent: 5725937 (1998-03-01), Johnston
patent: 5789066 (1998-08-01), De Mare et al.
Pohl et al., "Producing and Jointly Processing Base Laminates for Multilayer Printed Circuit Cards", IBM Technical Disclosure Bulletin, vol. 27, No. 8, Jan. 1985, pp. 4841-4842.
Declaration of Robert Jordan, United States District Court, Northern District of California, San Jose Division, Case No. C92 20672 JW (PVT), Nov. 25, 1992.
Declaration of Glynn Shaw, United States District Court, Northern District of California, San Jose Division, Case No. C92 20672 JW (PVT), Nov. 30, 1992.
Declaration of Alan Gishi, United States District Court, Northern District of California, San Jose Division, Case No. C92 20672 JW (PVT), Dec. 7, 1992.
Memorandum to the Assistant Comissioner of Patents, Response to Petition for Public Use Proceeding Under 37 CFR 1.292, Ser. No. 07/955,121, United States Patent and Trademark Office, Dec. 8, 1994, pp. 3-4.
Examiner's Action, Ser. No. 07/955,121 United States Patent and Trademark Office, Jul. 11, 1996, pp. 7-8.
Hinton, P., "The High-Yield Challenge in Laminating MLBs", Electronic Packaging and Production, vol. 30, No. 1, pp. 56-61, Jan. 1990.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Copper/steel laminated sheet for use in manufacturing printed ci does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Copper/steel laminated sheet for use in manufacturing printed ci, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Copper/steel laminated sheet for use in manufacturing printed ci will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-193181

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.