Copper-silver alloy wire and method for manufacturing the same

Stock material or miscellaneous articles – All metal or with adjacent metals – Foil or filament smaller than 6 mils

Reexamination Certificate

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Details

C428S673000, C428S675000, C148S525000

Reexamination Certificate

active

07491449

ABSTRACT:
An exemplary copper-silver alloy wire includes a conductive core containing copper, and a copper-silver cladding layer surrounding the conductive core. A ratio of silver to copper by weight in the copper-silver cladding layer is in a range from 1% to 30%. An exemplary method for manufacturing the copper-silver alloy wire includes steps of: providing a conductive core containing copper; forming a silver layer surrounding the conductive core; and heating the silver layer and peripheral portions of the conductive core so as to form a copper-silver cladding layer at an interface between the silver layer and the conductive core. The copper-silver alloy wire has high electrical conductivity, low current loss and high anti-interference.

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English language translation of JP 01-122514, Apr. 2008, 10 pages.
Translation of JP 50-60792. no date.
Translation of JP 01-122514. no date.

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