Copper ring solder mask defined ball grid array pad

Details Copper ring solder mask defined ball grid array pad Copper ring solder mask defined ball grid array pad

2007-06-12

2007-06-12

Clark, S. V. (Department: 2823)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Of specified configuration

C257S784000, C257S786000

Reexamination Certificate

active

10402101

ABSTRACT:
A ball grid array device includes a substrate, further including a first major surface and a second major surface. An array of pads is positioned on one of the first major surface or the second major surface. At least some of the pads include a raised ring. The raised ring circumscribes the pad or surrounds an interior pad or land on the substrate.

REFERENCES:
patent: 3508124 (1970-04-01), Lowry et al.
patent: 4622576 (1986-11-01), Buynoski
patent: 5148265 (1992-09-01), Khandros et al.
patent: 5415555 (1995-05-01), Sobhani
patent: 5977632 (1999-11-01), Beddingfield
patent: 6084296 (2000-07-01), Colello et al.
patent: 6104087 (2000-08-01), DiStefano et al.
patent: 6465878 (2002-10-01), Fjestad et al.

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