Compositions: coating or plastic – Coating or plastic compositions – Metal-depositing composition or substrate-sensitizing...
Patent
1999-08-03
2000-08-15
Klemanski, Helene
Compositions: coating or plastic
Coating or plastic compositions
Metal-depositing composition or substrate-sensitizing...
10628714, 10628718, 1062867, 438687, 427124, 4272481, 427250, 556 12, 556110, 556112, 556117, 556465, C23C 1618, C09K 300, C07F 108, C07F 708, B05D 512
Patent
active
061029939
ABSTRACT:
Copper precursor formulations, including a copper precursor with at least one of (a) water, (b) a water precursor and (c) a non-ligand organic hydrate, are useful in CVD processes, e.g., in liquid delivery chemical vapor deposition, for forming a copper-containing material on a substrate. The disclosed copper precursor formulations are particularly useful in the formation of copper layers in semiconductor integrated circuits, e.g., for metallization of interconnections in such semiconductor device structures.
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Baum Thomas H.
Bhandari Gautam
Xu Chongying
Advanced Technology & Materials Inc.
Hultquist Steven J.
Klemanski Helene
Zitzmann Oliver A. M.
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