Copper powder for use in conductive paste

Details Copper powder for use in conductive paste Copper powder for use in conductive paste

1987-03-23

1988-11-01

Barr, Josephine

Stock material or miscellaneous articles

Coated or structually defined flake, particle, cell, strand,...

Particulate matter

4271261, 427217, 427220, 252512, 252518, 252520, 75117, 75244, 75247, 75 05A, B32B 516, H01B 106, C22B 1500

Patent

active

047819804

ABSTRACT:
The present invention provides a copper powder for use in a conductive paste which allows the paste to possess excellent initial electrical conductivity, thermal resistance, and humidity resistance, and which enables the paste to maintain stable electrical conductivity for a long period of time. The copper powder of the present invention comprises a raw material copper powder; an anti-oxidization film comprising an organic acid salt of a higher aliphatic amine which is formed on the surface of the copper powder; and a surface film which comprises 0.2 to 10 parts by weight of a dispersing agent of a boron-nitrogen composite type and 0.1 to 10 parts by weight of at least one coupling agent of the group consisting of isopropyl-triisostearoyl-titanate and aceoalkoxy-aluminum-diisopropylate, relative to 100 parts by weight of the copper powder, and which is formed on the anti-oxidization film.

REFERENCES:
patent: 4094853 (1978-06-01), Monte
patent: 4305847 (1981-12-01), Stoetzier
patent: 4529555 (1985-07-01), Matsushita
patent: 4680140 (1987-07-01), Kageyama

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