Copper powder for electrically conductive paste

Details Copper powder for electrically conductive paste Copper powder for electrically conductive paste

2005-04-19

2005-04-19

Mai, Ngoclan T. (Department: 1742)

Specialized metallurgical processes, compositions for use therei

Compositions

Loose particulate mixture containing metal particles

C075S252000, C075S373000, C428S570000

Reexamination Certificate

active

06881240

ABSTRACT:
When copper powder manufactured by a wet reduction method is kneaded with resin in a high filling rate, it is difficult to maintain a low viscosity. The invention is to solve the problem of high viscosity without changing the characteristics such as particle size and specific surface area of the copper powder obtained by a wet reduction method. This invention relates to copper powder for an electrically conductive paste wherein copper powder manufactured by a wet reduction method is subjected to a surface-flattening treatment in which the particles are mechanically collided each other.

REFERENCES:
patent: 4600604 (1986-07-01), Siuta
patent: 5741347 (1998-04-01), Miki
patent: 6080336 (2000-06-01), Suehiro et al.
patent: 6174344 (2001-01-01), Hayashi et al.
patent: 62-99406 (1987-05-01), None
patent: 2-197012 (1990-08-01), None
patent: 4-116109 (1992-04-01), None
patent: 2000-144217 (2000-05-01), None

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