Specialized metallurgical processes – compositions for use therei – Compositions – Loose particulate mixture containing metal particles
Reexamination Certificate
2005-04-05
2005-04-05
Mai, Ngoclan T. (Department: 1742)
Specialized metallurgical processes, compositions for use therei
Compositions
Loose particulate mixture containing metal particles
Reexamination Certificate
active
06875252
ABSTRACT:
A copper powder is provided that has an average particle diameter in the range of from not less than 0.1 μm to less than 1.5 μm, that has a narrow particle size distribution width whose value A defined by Equation (1) below in terms of X25, X50 and X75 defined below is not greater than 1.2, and that forms a pseudo-fused sintered product when held at a temperature of 800° C. under an atmosphere of inert gas at one atmosphere pressure:in-line-formulae description="In-line Formulae" end="lead"?A=(X75−X25)/X50 (1),in-line-formulae description="In-line Formulae" end="tail"?where X25, X50 and X75 are values of particle diameter X corresponding to Q %=25%, 50% and 75% on a cumulative particle-size curve plotted in an orthogonal coordinate system whose abcissa represents particle diameter X (μm) and ordinate represents Q % (ratio of particles present of a diameter not greater than the corresponding value of X; expressed in units of vol % of particles). The copper powder is produced by conducting wet reduction of cuprous oxide into metallic copper powder in the presence of ammonia or an ammonium salt. When used to form the terminal electrodes of multi-layer capacitor, it enables the electrodes to form into solid sintered bodies with few pores by sintering at a low temperature.
REFERENCES:
patent: 4818280 (1989-04-01), Langner et al.
patent: 4863510 (1989-09-01), Tamemasa et al.
patent: 5588983 (1996-12-01), Tani et al.
patent: 5801318 (1998-09-01), Tani et al.
patent: 6174344 (2001-01-01), Hayashi et al.
patent: 6379419 (2002-04-01), Celik et al.
patent: 6679937 (2004-01-01), Kodas et al.
patent: 62-99406 (1987-05-01), None
patent: 2-197012 (1990-08-01), None
patent: 4-116109 (1992-04-01), None
Miyoshi Hiromasa
Okada Yoshihiro
Sano Kazushi
Takada Yoshiomi
Dowa Mining Co. Ltd.
Mai Ngoclan T.
McDermott Will & Emery LLP
LandOfFree
Copper powder and process for producing copper powder does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Copper powder and process for producing copper powder, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Copper powder and process for producing copper powder will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3373220