Copper plating process for printed circuit boards

Details Copper plating process for printed circuit boards Copper plating process for printed circuit boards

1979-11-09

1980-12-30

Kaplan, G. L.

Chemistry: electrical and wave energy

Processes and products

C25D 338

Patent

active

042421810

ABSTRACT:
Printed circuit boards are plated with a high acid-low copper sulfate bath which uses a grain refining agent comprising the extract of regular coffee added in an amount of between 0.1 and 1.0 g/l of bath solution. The bath is operated at a plating current density of between 15 and 60 asf and a bath temperature in the range of 20.degree. to 40.degree. C.

REFERENCES:
patent: 3769179 (1973-10-01), DuRose et al.

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