Copper plating process and wiring board

Details Copper plating process and wiring board Copper plating process and wiring board

1994-04-28

1995-09-05

Picard, Leo P.

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

174250, 174256, H05K 0100

Patent

active

054480213

ABSTRACT:
An electroless nickel plating is used as a primer for electroplating of copper. Preferably, electroless nickel plating is conducted after the surface of aluminum is subjected to nickel substitution with a nickel salt under a strongly acidic condition (pH: 1 or less). More preferably, the nickel substitution is carried out after the oxide film on the surface of aluminum is removed.

REFERENCES:
patent: 3781596 (1973-12-01), Galli et al.
patent: 4713494 (1987-12-01), Oikawa et al.

Affiliated with

Also associated with

Rating

Copper plating process and wiring board does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Copper plating process and wiring board, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Copper plating process and wiring board will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-473422