Copper plating process

Electrolysis: processes – compositions used therein – and methods – Electrolytic coating – Treating substrate prior to coating

Reexamination Certificate

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C205S291000

Reexamination Certificate

active

07857960

ABSTRACT:
Providing a copper plating method with which to precipitate copper-plated membranes that are uniform and flat, and that have good mirror gloss even when relatively thin copper plated membranes are formed. A copper plating method wherein the object to be plated and a pre-treatment solution in which bromide compound ions are contained are brought into contact and copper is precipitated by means of electrical plating using a copper plating solution.

REFERENCES:
patent: 589623 (1897-09-01), Chen et al.
patent: 2931760 (1960-04-01), Westbrook
patent: 4336114 (1982-06-01), Mayer et al.
patent: 4374709 (1983-02-01), Combs
patent: 4604299 (1986-08-01), De Luca et al.
patent: 5514293 (1996-05-01), Shimakura et al.
patent: 5616549 (1997-04-01), Clark
patent: 6645364 (2003-11-01), Calvert et al.
patent: 6709564 (2004-03-01), Tench et al.
patent: 6793796 (2004-09-01), Reid et al.
patent: 6863795 (2005-03-01), Teerlinck et al.
patent: 6946065 (2005-09-01), Mayer et al.
patent: 7232528 (2007-06-01), Hosomi et al.
patent: 7405157 (2008-07-01), Reid et al.
patent: 2004/0045832 (2004-03-01), Martyak
patent: 2006/0049058 (2006-03-01), van Wijngaarden et al.
patent: 2006/0252254 (2006-11-01), Basol
patent: 2007/0215490 (2007-09-01), Dow et al.
patent: 2009/0038951 (2009-02-01), Hayashi et al.
patent: 1 072 860 (1960-01-01), None
patent: 05255860 (1993-10-01), None
patent: 427097 (1974-10-01), None
patent: 697552 (1979-11-01), None
patent: 819233 (1981-04-01), None
patent: 1010161 (1983-04-01), None
patent: WO 01/24239 (2001-04-01), None
patent: WO 03000954 (2003-12-01), None
Carvalhal et al., “Polycrystalline Gold Electrodes: A Comparative Study of Pretreatment Procedures Used for Cleaning and Thiol Self-Assembly Monolayer Formation”, Electroanalysis (no month, 2005), vol. 17, No. 14, pp. 1251-1259.
Smol'yaninov, “The Influence of Halide Ions on the Corrosion Stability and the Electrochemical Behavior of Copper in Sulfuric and in Hydrochloric Acid”, Izvestiya Vysshikh Uchebnykh Zavedenii, Khimiya i Khimicheskaya Tekhnologiya (no month, 1964), vol. 7, No. 4, pp. 588-593. Abstract Only.
Smol'yaninov, “The Influence of Halide Ions on the Corrosion Stability and the Electrochemical Behavior of Copper in Sulfuric and in Hydrochloric Acid”, Izvestiya Vysshikh Uchebnykh Zavedenii, Khimiya i Khimicheskaya Tekhnologiya (no month, 1964), vol. 7, No. 4, pp. 588-593. Full Document.
Website: http://swatlab.nmsu.edu/conv.html; Conversion Factors; downloaded Nov. 16, 2009.
Smol'yaninov; The Influence of Halide Ions on the Corrosion Stability and the Electrochemical Behavior of Copper in Sulfuric and Hydrochloric Acid;Izvestiya Vysshikh Uchebnykh Zavedenil, Kimiyai I Khimicheskaya Teknologiya; (1964), vol. 7, No. 4, pp. 588-593.

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