Electrolysis: processes – compositions used therein – and methods – Electrolytic coating – Treating substrate prior to coating
Reexamination Certificate
2008-08-11
2010-12-28
Wong, Edna (Department: 1795)
Electrolysis: processes, compositions used therein, and methods
Electrolytic coating
Treating substrate prior to coating
C205S291000
Reexamination Certificate
active
07857960
ABSTRACT:
Providing a copper plating method with which to precipitate copper-plated membranes that are uniform and flat, and that have good mirror gloss even when relatively thin copper plated membranes are formed. A copper plating method wherein the object to be plated and a pre-treatment solution in which bromide compound ions are contained are brought into contact and copper is precipitated by means of electrical plating using a copper plating solution.
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Carvalhal et al., “Polycrystalline Gold Electrodes: A Comparative Study of Pretreatment Procedures Used for Cleaning and Thiol Self-Assembly Monolayer Formation”, Electroanalysis (no month, 2005), vol. 17, No. 14, pp. 1251-1259.
Smol'yaninov, “The Influence of Halide Ions on the Corrosion Stability and the Electrochemical Behavior of Copper in Sulfuric and in Hydrochloric Acid”, Izvestiya Vysshikh Uchebnykh Zavedenii, Khimiya i Khimicheskaya Tekhnologiya (no month, 1964), vol. 7, No. 4, pp. 588-593. Abstract Only.
Smol'yaninov, “The Influence of Halide Ions on the Corrosion Stability and the Electrochemical Behavior of Copper in Sulfuric and in Hydrochloric Acid”, Izvestiya Vysshikh Uchebnykh Zavedenii, Khimiya i Khimicheskaya Tekhnologiya (no month, 1964), vol. 7, No. 4, pp. 588-593. Full Document.
Website: http://swatlab.nmsu.edu/conv.html; Conversion Factors; downloaded Nov. 16, 2009.
Smol'yaninov; The Influence of Halide Ions on the Corrosion Stability and the Electrochemical Behavior of Copper in Sulfuric and Hydrochloric Acid;Izvestiya Vysshikh Uchebnykh Zavedenil, Kimiyai I Khimicheskaya Teknologiya; (1964), vol. 7, No. 4, pp. 588-593.
Hayashi Shinjiro
Takiguchi Hisanori
Piskorski John J.
Rohm and Haas Electronic Materials LLC
Wong Edna
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