Copper plating procedure

Details Copper plating procedure Copper plating procedure

1981-10-16

1984-03-20

Kaplan, G. L.

Chemistry: electrical and wave energy

Processes and products

204290R, 204290F, C25D 338

Patent

active

044379480

ABSTRACT:
A process is described for the electrodepositon of copper on various surfaces. The process involves use of a nonconsumable counterelectrode. Of particular significance is the composition of the surface of the counterelectrode. The surface of the counterelectrode comprises iridium oxide and tantalum oxide. Such processes can be carried out at high speeds, with smaller and more efficient equipment and can use various copper compounds as a source of copper.

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patent: 4067783 (1978-01-01), Okinaka et al.
patent: 4269670 (1981-05-01), Smith
patent: 4310391 (1982-01-01), Okinaka et al.
Journal of Applied Electrochemistry, vol. 1, 1971, pp. 231-243, "Fundamental and Applied Aspects of the Electrochemistry of Chlorine".

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