Copper plating bath having increased plating rate, and method

Details Copper plating bath having increased plating rate, and method Copper plating bath having increased plating rate, and method

1983-11-22

1985-09-10

Kaplan, G. L.

Chemistry: electrical and wave energy

Processes and products

204 44, C25D 338

Patent

active

045404739

ABSTRACT:
A copper plating bath containing a sulfur-containing anion other than sulfate anion and/or a selenium-containing anion other than a selenate anion and/or a tellurium-containing anion other than a tellurate anion in an amount sufficient to increase the plating rate, and method for electroplating copper onto a substrate with the plating bath.

REFERENCES:
patent: 2391289 (1945-12-01), Beaver, Jr.
patent: 2762762 (1956-09-01), Donahue
patent: 3328273 (1967-06-01), Creutz et al.
patent: 3617451 (1971-11-01), Slominski et al.
patent: 3767539 (1973-10-01), Clauss et al.
patent: 3838025 (1974-09-01), Toledo et al.
IBM Technical Disclosure Bulletin, "Electrodeposited Copper Films", H. Koretzky and P. T. Woodberry, vol. 9, No. 7, 12/66, p. 750.
Metal Finishing, "The Deposition of Copper from Phosphoric Acid Solutions", C. B. F. Young and F. Nobel, 11/49, pp. 56-59.

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