Copper plating bath formulation

Details Copper plating bath formulation Copper plating bath formulation

2008-08-11

2010-12-28

Wong, Edna (Department: 1759)

Electrolysis: processes, compositions used therein, and methods

Electrolytic coating

Depositing predominantly single metal coating

C205S296000

Reexamination Certificate

active

07857961

ABSTRACT:
To provide a copper plating solution composition that precipitates copper plated membranes that are both uniform and smooth and which has good external appearance even if the copper plated membranes that are formed are relatively thin. The copper plating solution composition contains chlorine ions and bromide ions in specific volumes.

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