Copper plating bath and process for difficult to plate metals

Details Copper plating bath and process for difficult to plate metals Copper plating bath and process for difficult to plate metals

1989-10-25

1991-02-05

Kaplan, G. L.

Chemistry: electrical and wave energy

Processes and products

204 521, C25D 338, C25D 530, C25D 538

Patent

active

049902245

ABSTRACT:
An acid copper plating bath and process for using with electropositive metals such as aluminum and tungsten is described, wherein the bath contains sulfuric acid, copper sulfate, in solution with urea as a levelling agent, a cationic surfactant as a wetting agent and an ester of a sulfonic acid, Beta-phenylethyltosylate as a brightening agent.

REFERENCES:
patent: 3732151 (1973-05-01), Abbott
patent: 3769179 (1973-10-01), Durose et al.
patent: 3923613 (1975-12-01), Immel
patent: 4036710 (1977-07-01), Kardos et al.
patent: 4242181 (1980-12-01), Malak
patent: 4576685 (1986-03-01), Goffredo et al.
patent: 4686017 (1987-08-01), Young

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