Coating processes – Measuring – testing – or indicating
Patent
1986-10-27
1987-11-17
Smith, John D.
Coating processes
Measuring, testing, or indicating
427345, 4274431, C23C 1840
Patent
active
047073772
ABSTRACT:
Copper is plated onto a substrate from an electroless plating bath having a mix potential relative to a saturated calomel electrode of about minus 630 to about minus 675 millivolts at a temperature of about 73.degree. C. The mix potential of the bath is monitored and adjusted during the plating to maintain it at about minus 630 to about minus 675 millivolts with respect to a calomel electrode at a temperature of about 73.degree. C. The number of of plating void defects is thereby reduced.
REFERENCES:
patent: 3635758 (1972-01-01), Schneble
patent: 3844799 (1974-10-01), Undeckofler
patent: 3959531 (1976-05-01), Schneble
patent: 4002786 (1977-01-01), Hirohata
patent: 4152467 (1979-05-01), Alpaugh
Paunovic, "Electrochemical Aspects of Electroless Deposition of Metals", Photo Circuits Corporation, Plating, Nov. 1968, pp. 2-8.
Tucker, "Instrumentation and Control of Electroless Copper Plating Solutions", American Electroplaters' Society, Inc., Ft. Worth, Texas--Jan. 21-22, 1976.
Greene, "Evaluating the Condition of Electroless Plating Baths", IBM TDB, vol. 17, No. 3, Aug. 1964, pp. 171, 172.
Capwell Robert J.
Kaschak Ronald A.
McBride Donald G.
Rickert Robert G.
Seraphim Donald P.
International Business Machines - Corporation
Smith John D.
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