Copper paste for internal conductor of multilayer ceramic electr

Details Copper paste for internal conductor of multilayer ceramic electr Copper paste for internal conductor of multilayer ceramic electr

1993-01-11

1994-05-31

Skaling, Linda

Compositions

Electrically conductive or emissive compositions

Free metal containing

252518, 106 118, 106 123, H01B 100, H01B 102

Patent

active

053166981

ABSTRACT:
Copper paste containing copper powder having a mean particle size of 0.5 to 2 .mu.m and a particle size range of 0.3 to 4 .mu.m an organic vehicle and a solvent, the paste including 40 to 60 percent by weight copper powder is applied onto ceramic green sheets in a thickness of 1 to 3 .mu.m, for forming internal conductors of a multilayer ceramic electronic component, such as a multilayer ceramic capacitor. The ceramic green sheets provided with such copper paste films are stacked and fired so that occurrence of voids in the laminate and deformation of the laminate are suppressed in the resulting multilayer ceramic electronic component.

REFERENCES:
patent: 5035837 (1991-07-01), Saeki et al.

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