Copper paste for internal conductor of multilayer ceramic electr

Details Copper paste for internal conductor of multilayer ceramic electr Copper paste for internal conductor of multilayer ceramic electr

1994-11-14

1996-05-07

Walsh, Donald P.

Powder metallurgy processes

Powder metallurgy processes with heating or sintering

Making composite or hollow article

419 5, 419 8, 419 10, 419 19, B22F 702

Patent

active

055143261

ABSTRACT:
In order to form internal conductors of a multilayer ceramic electronic component such as a multilayer ceramic capacitor, copper paste containing copper powder having a mean particle size of 0.3 to 2 .mu.m in a particle size range of 0.1 to 4 .mu.m and ceramic powder having a main component which is common to that of a ceramic material contained in the multilayer ceramic electronic component and being in a particle size range of 0.5 to 8 .mu.m, as well as an organic vehicle and a solvent with the contents of the copper powder and the ceramic powder and the total content of the organic vehicle and the solvent in ranges of 40 to 70 percent by weight, 1 to 15 percent by weight and 25 to 60 percent by weight respectively is applied onto ceramic green sheets. The ceramic green sheets provided with such copper paste films are stacked and fired so that occurrence of voids in the laminate and deformation of the laminate are suppressed in the as-obtained multilayer ceramic electronic component.

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patent: 4985381 (1991-01-01), Mori et al.
patent: 5117326 (1992-05-01), Sano et al.

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