Copper paste for forming conductive thick film

Details Copper paste for forming conductive thick film Copper paste for forming conductive thick film

1994-05-04

1995-05-23

Bell, Mark L.

Compositions: ceramic

Ceramic compositions

Glass compositions, compositions containing glass other than...

501 20, 252512, 106 113, 106 112, C03C 818, C03C 816

Patent

active

054181933

ABSTRACT:
Disclosed herein is copper paste for forming a conductive thick film, which contains 80 wt. % to 95 wt. % of spherical first copper powder of 1 .mu.m to 10 .mu.m in mean particle diameter, 0.5 wt. % to 15 wt. % of second copper powder of less than 1 .mu.m in mean particle diameter, and 1 wt. % to 15 wt. % of glass frit of 0.5 .mu.m to 2.0 .mu.m in mean particle diameter respectively as solid components. A conductive thick film obtained by applying the copper paste onto a substrate and baking the same exhibits excellent solderability as well as high adhesive strength to the substrate, and this adhesive strength is excellently maintained even if the thick film is exposed to a heat hysteresis.

REFERENCES:
patent: 5035837 (1991-07-01), Saiki et al.
CA 112:110052g Copper Post In Electrically Conductive Films. Abstract for Koho JP 01-167907 Jul. 3, 1989.

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