Copper paste composition

Details Copper paste composition Copper paste composition

1990-06-28

1991-07-30

Dixon, Jr., William R.

Compositions

Electrically conductive or emissive compositions

Free metal containing

252518, 106113, 106118, 106123, 106126, 501 19, 501 20, 501 32, H01B 106, C03C 816

Patent

active

050358375

ABSTRACT:
A copper paste composition for low temperature firing on a ceramic substrate is comprised of inorganic components and organic vehicle components. The inorganic components mainly consist of cooper powder, cuprous oxide powder, cupric oxide powder and glass powder. The mixing ratio off the inorganic components of this composition is 100 parts by weight of copper powder, about 10 to 15 parts by weight of cuprous oxide powder, about 12 to 17 parts by weight of cupric oxide powder, and about 7 to 12 parts by weight of glass powder. The mixing ratio of the inorganic components with the organic vehicle components is about 95 to 70 parts by weight of the organic vehicle components. Also the the average particle size of the copper powder is in a range of about 0.5 to 3 .mu.m and the oxygen content of the copper powder is about 0.05 to 0.15 weight percent.

REFERENCES:
patent: 3516949 (1970-06-01), Hoffman
patent: 4172919 (1979-10-01), Mitchell
patent: 4877555 (1989-10-01), Yuhaku et al.
European Search Report, dated Jan. 29, 1991, of European Patent Application EP 90 30 7467.
World Patent Index, Derwent-Publications Ltd., London, GB; & JP-A-62 263 894 (Matsushita Elec., JP) 16-11-1987.

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