Copper paste and wiring board using the same

Details Copper paste and wiring board using the same Copper paste and wiring board using the same

2007-11-06

2007-11-06

Norris, Jeremy C (Department: 2841)

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

C252S512000

Reexamination Certificate

active

10620361

ABSTRACT:
A wiring board comprising: a conductor layer comprising Fe and Cu; and at least one of a radiator, a connection terminal, a cover and a circuit component, connected to the conductor layer through a joining member, which is obtained by coating a copper paste comprising a copper powder, an organic vehicle and an Fe2O3particle as a conductor layer on a ceramic green sheet and firing it.

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Abstract of JP63-131405.
Machine translation of JP 2000-67646.
Patent Abstracts of Japan, vol. 014, No. 493, Oct. 26, 1990 & JP 02 204904 A (Asahi Glass Co Ltd), Aug. 14, 1990.

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