Compositions – Etching or brightening compositions
Reexamination Certificate
2011-06-07
2011-06-07
Culbert, Roberts (Department: 1716)
Compositions
Etching or brightening compositions
Reexamination Certificate
active
07955520
ABSTRACT:
The present invention provides chemical-mechanical polishing (CMP) methods and compositions for polishing copper-containing substrates. The methods of the present invention entail abrading a surface of a copper-containing substrate with a CMP composition of the invention, preferably in the presence of an oxidizing agent (e.g., hydrogen peroxide). The CMP compositions of the invention comprise a particulate abrasive, a copper-complexing agent, a copper-passivating agent bearing an acidic OH group and an additional oxygen substituent in a 1,6 relationship to the acidic OH group, and an aqueous carrier. A preferred composition of the invention comprises about 0.01 to about 1 percent by weight of the particulate abrasive, about 0.1 to about 1 percent by weight of the copper-complexing agent, about 10 to about 1000 ppm of the copper-passivating agent.
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Keleher Jason
Parker John
White Daniela
Cabot Microelectronics Corporation
Culbert Roberts
Omholt Thomas E.
Ross Robert J.
Weseman Steven D.
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