Copper particle clusters and powder containing the same...

Details Copper particle clusters and powder containing the same... Copper particle clusters and powder containing the same...

2005-08-02

2005-08-02

Kopec, Mark (Department: 1751)

Compositions

Electrically conductive or emissive compositions

Free metal containing

Reexamination Certificate

active

06923924

ABSTRACT:
Copper particle clusters constituting a powder suitable for making a conductive paste are provided that are individually composed of not fewer than two and not more than 20 unit particles joined through neck portions. A conductive paste made from the powder is excellent in conductivity. A conductive filler for conductive paste is provided that consists essentially of a mixture of copper particle clusters A individually composed of two or more unit particles joined through neck portions and spherical metallic particles B of smaller diameter than the particles A. A conductive paste made from the filler is low in viscosity and excellent in conductivity.

REFERENCES:
patent: 4122143 (1978-10-01), Momotari et al.
patent: 4776978 (1988-10-01), Herron et al.
patent: 5769996 (1998-06-01), McArdle et al.
patent: 5807508 (1998-09-01), Kawahara et al.
patent: 6423172 (2002-07-01), McArdle et al.
patent: 62-99406 (1987-05-01), None
patent: 2-197012 (1990-08-01), None
patent: 4-116109 (1992-04-01), None

Affiliated with

Also associated with

Rating

Copper particle clusters and powder containing the same... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Copper particle clusters and powder containing the same..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Copper particle clusters and powder containing the same... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3442257