Copper oxide-filled polymer die attach adhesive composition for

Details Copper oxide-filled polymer die attach adhesive composition for Copper oxide-filled polymer die attach adhesive composition for

1995-06-07

1996-12-10

McGinty, Douglas J.

Compositions

Electrically conductive or emissive compositions

Metal compound containing

524403, 524413, H01B 120, H01B 122

Patent

active

055827721

ABSTRACT:
There is disclosed a copper oxide-filled polymer die attach adhesive composition for semiconductor package The copper oxide-filled polymer die attach adhesive composition for semiconductor package is made of an adhesion resin mixture and an inorganic filler, wherein the inorganic filler includes copper oxide selected from a group consisting of CuO, Cu.sub.2 O and the mixture thereof in an amount of approximately 0.1 to approximately 90% by weight. Optionally, silver may be contained in the composition. It is capable of maintaining electric conductivity under severe temperature cycle as well as providing bonding strength enough to prevent package crack and delamination.

REFERENCES:
patent: 4387115 (1983-06-01), Kitamura et al.
patent: 4871811 (1989-10-01), Gaku et al.
patent: 4877555 (1989-10-01), Yuhaku et al.
patent: 4975221 (1990-12-01), Chen et al.

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