Copper-nickel-tin-cobalt spinodal alloy

Metal treatment – Stock – Copper base

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

148 115C, 148 115P, 148 127C, 148412, 419 28, C22C 902

Patent

active

047326255

ABSTRACT:
An age hardened spinodally decomposed alloy prepared by powder metallurgy consisting essentially of from about 5 to about 30 percent by weight nickel, from about 4 to about 13 percent by weight tin, from about 0.5 to about 3.5 percent by weight cobalt and the balance copper exhibits an excellent combination of strength, ductility, formability and electrical conductivity characteristics.

REFERENCES:
patent: 3937638 (1976-02-01), Plewes
patent: 3940290 (1976-02-01), Pryor et al.
patent: 3941620 (1976-03-01), Pryor et al.
patent: 3953249 (1976-04-01), Pryor et al.
patent: 4012240 (1977-03-01), Hinrichsen et al.
patent: 4052204 (1977-10-01), Plewes
patent: 4090890 (1978-05-01), Plewes
patent: 4130421 (1978-12-01), Plewes et al.
patent: 4142918 (1979-03-01), Plewes
patent: 4260432 (1981-04-01), Plewes
patent: 4373970 (1983-02-01), Scorey et al.
patent: 4406712 (1983-09-01), Louzon
patent: 4440572 (1984-04-01), Nadkarni et al.
patent: 4448852 (1984-05-01), Bose et al.
patent: 4460658 (1984-07-01), Bose et al.
patent: 4525325 (1985-06-01), Livak

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Copper-nickel-tin-cobalt spinodal alloy does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Copper-nickel-tin-cobalt spinodal alloy, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Copper-nickel-tin-cobalt spinodal alloy will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-440273

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.