Copper-nickel-silicon two phase quench substrate

Details Copper-nickel-silicon two phase quench substrate Copper-nickel-silicon two phase quench substrate

2007-11-06

2007-11-06

Ip, Sikyin (Department: 1742)

Metal treatment

Stock

Copper base

C148S686000, C420S485000, C420S486000, C420S487000, C420S488000

Reexamination Certificate

active

10644220

ABSTRACT:
A copper-nickel-silicon quench substrate rapidly solidifies molten alloy into microcrystalline or amorphous strip. The substrate is composed of a thermally conducting alloy. It has a two-phase microstructure with copper rich regions surrounded by a discontinuous network of nickel silicide phases. The microstructure is substantially homogeneous. Casting of strip is accomplished with minimal surface degradation as a function of casting time. The quantity of material cast during each run is improved without the toxicity encountered with copper-beryllium substrates.

REFERENCES:
patent: 4142471 (1979-03-01), Narasimhan
patent: 4290435 (1981-09-01), Waggott
patent: 4537239 (1985-08-01), Budzyn et al.
patent: 4818307 (1989-04-01), Mori et al.
patent: 5564490 (1996-10-01), Liebermann et al.
patent: 5842511 (1998-12-01), Raybould et al.
patent: 5846346 (1998-12-01), Lee et al.
patent: 6251199 (2001-06-01), Mandigo et al.
patent: 6764556 (2004-07-01), Myojin et al.
patent: 0024506 (1980-06-01), None
patent: 0024506 (1980-06-01), None
patent: 59-020440 (1984-02-01), None
patent: 04 099140 (1992-07-01), None
patent: 09 143596 (1997-10-01), None
Popa et al., New High-Temperature Copper Alloys, Journal of Materials Engineering and Performance, ASM International, vol. 5, No. 6, Dec. 1, 1996, pp. 695-698.
Database Compendex Online, Engineering Information, Inc., Popa et al., “Caracteristicile Sistemului Cu-Ni-Si, Functie de Compusul Ni2Si” (Abstract) & Cercet Metal 1977 Inst. de Cercet Metal, Bucharest, Romania, vol. 18, pp. 513-521.
XP 000635188 “New High-Temperature Copper Alloys” A. Popa et al., JMEPEG (1996) pp. 695-698 (In English) (previously submitted).
PCT Notification of Transmittal of the International Search Report and the Written Opinion of the International Searching Authority, or the Declaration, PCT/US04/26381, Jul. 24, 2006.
PCT International Search Report, PCT/US04/26481 Jul. 24, 2006.
PCT Written Opinion of the International Searching Authority, PCT/US04/26381 Jul. 24, 2006.
PCT Notification Of Transmittal Of International Preliminary Examination Report, Form PCT/IPEA/416, dated Jan. 23, 2007 (1pg) (in English).
PCT International Preliminary Examination Report, Form PCT/IPEA/409 (3 pgs) (in English).

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